A new technical paper titled “Hybrid Bonding with Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography ...

Enabling full multi-die system functional verification and early testing long before interposer characteristics are pinned ...

Nobody wants standards until the lack of them inhibits the development of the solutions that they need. That is often too ...

A Theoretical Framework for Time, Space, and Energy Scaling” was published by researchers at Sandia National Laboratories. Abstract “Neuromorphic computing (NMC) is increasingly viewed as a low-power ...

A Hardware Performance Counter-Based Intrusion Detection System for DoS Attacks on Automotive CAN bus” was published by researchers at Dumarey Softronix and Politecnico di Torino. Abstract “The ...

Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration” was published by researchers at Georgia Institute of Technology. Abstract “Conventional large language ...

Avoiding End-to-End Slowdowns in Accelerated Chip Multi-Processors” was published by researchers at Cornell University and Intel Labs. Abstract “Recent chip multiprocessors incorporate several on-chip ...

Practical insights into the quantum landscape of 2025 and how organizations can benefit from this technological revolution.

Memristors in action: Sort-in-memory, a nervous system for robots, RF signal processing. Researchers from Peking University ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

This report focuses on different interconnect structures, such as lines, vias, buses, and networks-on-chip, and how they’re ...

AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...