Abstract: Advances in novel hardware devices and architectures allow Spiking Neural Network (SNN) evaluation using ultra-low power, mixed-signal, memristor crossbar arrays. As individual network sizes ...

Abstract: This study focuses on the fabrication and thermomechanical characterization of Through Silicon Vias (TSV) with diameters spanning 1-4 µm. In terms of TSV fabrication, scallop-free Si etching ...