Abstract: Flip chip technology has been extensively adopted in integrated circuit (IC) packaging, and the integration of flip chip technology with solder joint interconnection methods has been ...

Abstract: During reflow soldering, voids inevitably emerge inside the solder joints of chip resistors, which will influence the reliability of the electronic device. In this article, an adaptive ...

On September 18, Shiyun Circuit announced in its investor relations activity record that the new generation PCB product 'Chip Innovation Intelligence Carrier' has a high technological content and ...