Fix point defects in semiconductors to enable smaller, faster chips with better yield—using MoS₂ at industry-safe ...

Tattooing tardigrades opens new paths for nanotechnology in living tissue, from sensors to cell-level medical applications.

SureCore has launched a comprehensive suite of silicon services to help customers develop cutting-edge applications that address complex design requirements. Leveraging its extensive experience in low ...

The new USB Type-C Cable and Connector Specification Release 2.4 has lowered voltage detection thresholds (0.613V for 1.5A source and 1.165V for 3A source). These MCUs are the industry’s first to ...

ROHM has extended its portfolio of surface-mount NIR LEDs with new compact top-view types. They are optimised for applications such as VR/AR devices, industrial optical sensors, and human detection ...

Optimotive has announced the official full rollout of IRIS MK2, its next-generation autonomous robot designed to revolutionise data collection in construction and other challenging outdoor ...

The FORTEC Group has announced a strategic partnership with ENEDO, a global leader in power supply solutions. This collaboration combines ENEDO’s cutting-edge technology with FORTEC’s localised ...

With the NVIDIA MGX reference architecture, system manufacturers can quickly and cost-effectively build more than 100 server variations. Advantech is releasing a series of NVIDIA MGX GPU servers ...

The kit includes a full set of innovative Modulino nodes for reliable sensing and actuation capabilities with seamless Cloud connectivity via the Arduino Global Pro 4G Module and an Arduino Cloud for ...

With the new, non-isolated DC-DC switching regulators of the series, the company offers a direct replacement for the lossy standard linear regulators of the LM78 series. Accordingly, the series with ...

Insulated Wire Inc. will be exhibiting at the IEEE MTT-S International Microwave Symposium (IMS) from 15th to 20th June.

Intel enters memory market with SoftBank to build AI-ready DRAM, tackling bottlenecks with silicon innovation.