Small-batch SMT chip processing often faces the challenge of high costs due to low order volumes and high production ...

At the edge Models are built on the cloud and applied at the edge. Moving data from inspection/metrology systems to the cloud to make a decision to execute back at the system is simply impractical.

Abstract: Polyimide cracking is a significant reliability challenge when packing a Wafer-Level Chip Packaging (WLCSP) on substrate with normal flip chip process. In this study, 3-layer WLCSPs were ...