Abstract: There are several chip-to-substrate interconnection technologies in the packaging tool kit such as mass reflow (MR), thermocompression bonding (TCB) and laser assisted bonding (LAB). MR is a ...

Abstract: Ten percent of full-scale Orion conical ribbon drogue parachutes in the wake of a 10% command module were tested in a subsonic 3×2.1 m (10'×7') cross section, subsonic atmospheric wind ...