Abstract: During reflow soldering, voids inevitably emerge inside the solder joints of chip resistors, which will influence the reliability of the electronic device. In this article, an adaptive ...

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Abstract: Solder bump bridging (SBB) induced during chip attach process could cause electrical failure and device to malfunction. These SBB defects went undetected due to complex circuitry, test ...

On September 18, Shiyun Circuit announced in its investor relations activity record that the new generation PCB product 'Chip Innovation Intelligence Carrier' has a high technological content and ...