Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

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What would it be like to watch a movie scene on top of a cliff and feel the wind blow through your hair as if you were there? Or to smell the roses as a character in a film walks through a flower ...

Abstract: Reliable 3D object perception is essential in autonomous driving. Owing to its sensing capabilities in all weather conditions, 4D radar has recently received much attention. However, ...

Abstract: A review of recent studies on up-to-date IC shows that electromigration (EM) has become one of the major challenges for 2.5D and 3D chiplet heterogeneous integration (CHI) systems. However, ...